发明名称 BONDING OF RUBBER
摘要 PURPOSE:To impart a high adhesion strength to a rubber molding and an object to be bonded without giving any heat hysteresis by bonding the rubber molding on the object after a reactive pretreating agent is transferred on the surface thereof by a heat/pressure molding with a metal mold coated with the agent on the inner surface thereof. CONSTITUTION:A rubber material (e.g. urethane rubber and chloroprene rubber) fills a molding metal mold coated on the inner surface thereof with a reactive pretreating agent and molded by heating under a pressure to transfer the pre- treating agent onto the surface of a rubber molding. An object to be bonded such as metal member is bonded to the surface of the rubber molding with an epoxy adhesive or the like. EFFECT:No special treating process is required at the time of the primer process.
申请公布号 JPS5892552(A) 申请公布日期 1983.06.01
申请号 JP19810192424 申请日期 1981.11.30
申请人 SHOWA DENSEN DENRAN KK 发明人 KOGANE MASARU;AKAHA HISASHI
分类号 B29C65/00;B29B13/00;B29B15/00;B29C33/00;B29C55/00;B29C65/48;B29C65/78;C08J5/00 主分类号 B29C65/00
代理机构 代理人
主权项
地址