发明名称 |
BONDING OF RUBBER |
摘要 |
PURPOSE:To impart a high adhesion strength to a rubber molding and an object to be bonded without giving any heat hysteresis by bonding the rubber molding on the object after a reactive pretreating agent is transferred on the surface thereof by a heat/pressure molding with a metal mold coated with the agent on the inner surface thereof. CONSTITUTION:A rubber material (e.g. urethane rubber and chloroprene rubber) fills a molding metal mold coated on the inner surface thereof with a reactive pretreating agent and molded by heating under a pressure to transfer the pre- treating agent onto the surface of a rubber molding. An object to be bonded such as metal member is bonded to the surface of the rubber molding with an epoxy adhesive or the like. EFFECT:No special treating process is required at the time of the primer process. |
申请公布号 |
JPS5892552(A) |
申请公布日期 |
1983.06.01 |
申请号 |
JP19810192424 |
申请日期 |
1981.11.30 |
申请人 |
SHOWA DENSEN DENRAN KK |
发明人 |
KOGANE MASARU;AKAHA HISASHI |
分类号 |
B29C65/00;B29B13/00;B29B15/00;B29C33/00;B29C55/00;B29C65/48;B29C65/78;C08J5/00 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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