| 摘要 |
<p>PURPOSE:To offer a package which is excellent in hermetic sealing function and heat radiating function and has high reliability, by providing a bellows in a package and thus removing the heat generated in a semiconductor element via said bellows. CONSTITUTION:The semiconductor element 2 of flip chip form bonded on the substrate 1 is held in surface contact by the bellows 3 having variability provided at a part of the package 4 directly contacted on the element and held by a fixed pressure. The package 4 is fixed on the substrate 1 by a junction part 4A by using the same means as the usual hermetic sealing method for the semiconductor element 2. Thereat, the bellows 3 deflects in a fixed amount and held by a fixed pressure, and accordingly the hermetic sealing of an element space 4B is secured. The package 4 wherein the element space 4B and thermal contacts are held rapidly removes the heat generated in the semiconductor element 2 out to the air via the bellows 3 by mounting a heat radiating fins 5 outside by screws, fitting, adhesion, etc.</p> |
