发明名称 INTERLAYER BONDING METHOD IN 3-DIMENSIONAL ELEMENT
摘要 <p>PURPOSE:To eliminate the conductive line for an electric coupling and to enable to individual superpose layers by employing light or electromagnetic waves of various wavelengths generated from a semiconductor laser or a photodiode when multilayers forming three-dimensional elements are coupled to each other. CONSTITUTION:Layers 1, 1' formed with respective devices are coupled through an insulating film 2, and a signal which is fed to a sensor or an input unit formed at the layer 1 is fed to a light emitting device 5 such as a semiconductor laser which is contacted with the film 2 side of the layer 1. Then, a laser signal which is produced at the device 5 is fed to a photodetector 6 which is formed at the layer 1' and is contacted with the film 2, and an obtained electric signal is fed externally. In this structure, a light or electromagnetic wave which is produced from a semiconductor laser or a photodiode is emitted for coupling, thereby eliminating the special device for coupling. In this manner, the respective device layers 1, 1' are separately formed, and may be superposed later.</p>
申请公布号 JPS5886764(A) 申请公布日期 1983.05.24
申请号 JP19810186018 申请日期 1981.11.18
申请人 MITSUBISHI DENKI KK 发明人 KATOU TAKAAKI;ITAKURA HIDEAKI;KOYAMA HIROSHI
分类号 H05B33/00;H01L27/00;H01L27/15;H01L31/12;H01L31/167;H01S5/00 主分类号 H05B33/00
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