| 摘要 |
PURPOSE:To prevent the contamination of a treatment chamber and a wafer without the necessity of opening a spare exhaust chamber to atmosphere and further allow the in-line processing wherein the wafer manufacturing line is directly combined with front-to-back processes, by settling a differential exhaust device wherein a rotary sub valve device and a sub vacuum chamber are combined in at least one stage in a treatment chamber or a spare exhaust chamber. CONSTITUTION:The rotary sub valve 1 is rotated by a roatry device 9, the slit 3a of the rotary sub valve 1 is made to agree with the slit 3b of a valve box 4, and then a wafer 2 carried from the atmosphere side by a belt 10a is passed through the slits 3a, 3b and carried into the vacuum side by a belt 10b. After the wafer 2 is completely passed through the slits 3a, 3b, the rotary sub valve 1 is rotated by the rotary device 9 so that the slit 3a may be crossed with the slit 3b at right angle, and accordingly the atmosphere side and the vacuum side are shut off to each other. |
