| 摘要 |
PURPOSE:To improve the bonding strength and the sealability of a sealing cover for an IC package by forming a plating layer of gold or the like on the sealing surface of a cover body, fusing solder on the layer, thereby preventing the diffusion of the solder in the sealing surface and the production of voids. CONSTITUTION:A cover body 1 is made of a metal plate formed in the prescribed shape such as, for example, iron, nickel alloy. A plating layer 2 made of Au, Ag or their alloy is formed on the overall periphery of the body 1. Then, a seal ring 3 made of a solder is provided. This is formed by fusing the body 1 formed with the layer 2 in non oxidative atmosphere such as nitrogen or argon, and the entire ring 3 is bonded onto the layer 2 at one side peripheral edge of the body 1. In this mannr, the sealing cover 10 for an IC package improved in the bonding strength and the sealability can be obtained. |
