SEMICONDUCTOR CHIP CARRIER AND MANUFACTURE THEREOF

摘要

PURPOSE:To facilitate the construction of an IC or LSI upon an amorphous insulating surface by a method wherein a carrier is composed of an adhesive tape and a plurality of semiconductor chips fixed thereon. CONSTITUTION:A carrier of this design is composed of a polyimide-based adhesive film 1 and a plurality of semiconductor chips 3 fixed secure thereto by means of adhesive agent 2. As for the adhesive agent 2, it may be a polyimide- based adhesive agent capable of functioning as such at a lower temperature than the adhesive film 1. The adhesive film 1 is easily separated into segments by a pair of scissors or knife. A semiconductor chip may therefore be easily separated from others and fixed secure to a desired position on a different substrate for the local formation of a semiconductor device thereon. This design enables an IC or LSI to be easily constructed on an amorphous insulating surface.