Wafer surface contouring device.

摘要

A wafer transforming device defines an airtight space by means of a base (12), a hollow case (16), and a diaphragm type chuck (18) which is fixed to the upper end of the case (16) by suction. In this space (16), a large number of vertically moving elements (24) are arranged at predetermined intervals. In the state in which a wafer is held by suction by means of the chuck (18) and in which the chuck (18) is held in contact with the upper ends of the vertically moving elements (24) by supplying a vacuum pressure into the space, the vertically moving elements (24) located within a required range are selectively actuated. Thus, the chuck (18) is pushed up, and the wafer held on the chuck by the suction is transformed into a desired state.