发明名称 METHOD FOR WIRE BONDING
摘要 PURPOSE:To prevent the breakage of wire caused by the hook of wires by a method wherein vibration is given to a bonding tool moving the bonding position. CONSTITUTION:A wire 2 is bonded to a first bonding section 3 through a bonding tool 1. After completing bonding, the tool 1 moves in the arrow 5 direction and proceeds to a second bonding section 4. The tool 1 is provided with a vibration source 7 vibrating the tool 1 in the allow 8 directions. The vibration source 7 gives vibration to the tool 1 while the tool 1 is moving in the arrow direction 5. Vibration is compulsorily given to the tool 1. Therefore, the wire 2 will not be hooked to the tool 1, itself or in the path hole 6.
申请公布号 JPS5858737(A) 申请公布日期 1983.04.07
申请号 JP19810157520 申请日期 1981.10.05
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 FUJIOKA SHIYUNICHIROU;UEMATSU SHIYUNEI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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