| 摘要 |
PURPOSE:To reduce the production of a resin burr by forming a projection bead in the vicinity of the part to be formed with the outer wall of the molding resin of lead wirings, thereby preventing the flow-out of the resin at the resin molding time. CONSTITUTION:A semiconductor element 31 is fixed to the die stage 26 of a lead frame, and the terminals of the element 31 and lead wirings 27 having a projection bead 29 are connected to gold wirings 32 via wire bonding. Thereafter, resin molding dies 33, 34 are disposed to sandwich the lead frame, and the resin 35 is filled in the dies 33, 34. Since the beads 29 are formed at the wirings 27, the gap can be blocked, and the resin 35 does not almost flow out, and the production of resin burrs can be reduced. |
