发明名称 Electrical device allowing for increased device densities
摘要 Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.
申请公布号 US6914198(B2) 申请公布日期 2005.07.05
申请号 US20020237579 申请日期 2002.09.09
申请人 MICRON TECHNOLOGY, INC. 发明人 AKRAM SALMAN;FARNWORTH WARREN M.;WOOD ALAN G.;BROOKS J. MICHAEL;CLOUD EUGENE H.
分类号 H01L23/495;H05K1/02;H05K1/09;H05K3/32;(IPC1-7):H05K1/18 主分类号 H01L23/495
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