| 摘要 |
PURPOSE:To manufacture the semiconductor device with excellent thermal radiation and high reliability by a method wherein the surface area of lead pin stopper is expanded. CONSTITUTION:The conductive layer 2 is laminated on ceramic substrate 1 by means of patterning and the semiconductor element 4 placed thereon is connected to said conductive layer 2 by the lead wire 7 while the region of said semiconductor 4 and said lead wire 7 is enclosed by the cap 6 which is further enclosed by enclosing material 5. The surface area of nail head of the lead pin 3 transmitting the signals from the semiconductor elements in the semiconductor package is made circular cylinder type to be increased upto eight times. In order to expand the surface area of said lead pin 3, it is easy and preferable to increase the height of the nail head of lead pin while the preferable shape of said nail head is circular cylinder type but quadrangle cylinder type or any other polygon may be acceptable. The conductive layer 2 comprises the metalized layer such as molybdenum and manganese+Au plating while said lead pin is made of cobalt or copper plated with nickel etc. The conductive layer 2 and the lead pin 3 are connected by solder material such as silver solder and the like. |
