| 摘要 |
PURPOSE:To control a semiconductor manufacturing process (semiconductor substrate working process) by a method wherein process control marks and process completion marks are printed on the circumference of a semiconductor substrate. CONSTITUTION:Process control marks, A1, A2, ...showing a semiconductor manufacturing process are printed on the circumference of a wafer 11 by a laser beam or the like. Whenever each process is completed, dots 22 as process completion marks are printed around the schedule control marks by a laser beam or the like. A computer reads the abbreviation of a process name to perform process control. When the computer is failed, an operator judges the processing speed by observing the process completion marks. |
