Device and method for packaging electronic devices.

摘要

For use in producing a package enclosing an electronic device, a lead frame (1) is first treated by electroplating, separately from any outer housing structure component of the package, so as to provide a working contact layer on outerlead parts (3) of the frame. The electronic device is then fixed in its desired position relative to the lead frame, and electrical connections are provided between the device and innerlead parts (2) of the frame, whereafter a housing structure is sealed around the device so that it is enclosed within that structure, but so that outerlead parts covered by the said working contact layer are left projecting from that structure. The electroplating of the lead frame whilst still separate from the housing structure can serve to avoid such problems as contamination of the electroplating bath by the housing structure.