| 摘要 |
PURPOSE:To eliminate a crack of a substrate made of alumina or the like by forming a hybrid interated circuit on the substrate, and pressing a rectangular external lead terminal plated with Au on a plurality of Au pads provided on the circuit through a spacer with a wedge of wide shape when the terminal is thermally press-bonded. CONSTITUTION:A hybrid integrated circuit 1 having the prescribed circuit 3 is formed on a substrate 2 made of alumina or partially glazed alumina is formed, and a plurality of Au plating rectangular external lead terminals 4 are respectively thermally press-bonded to a plurality of Au pads provided at the circuit 1. At this time, to perform the press-bonding in a short time, a bonding wedge is used, but the substrate might be cracked by the large pressing force in this state. Accordingly, a soft metal spacer 6 which is made of Cu, Al in a rectangular section in thickness substantially equal to the total thickness of the substrate 2 and the terminal 4 is interposed between the wedge of the wide shape and the terminal 4, and are placed and pressed on the thermally press- bonding table 5. |
