| 摘要 |
Apparatus and a related method for its operation, for removing a cover from a microcircuit package without significant damage to the package or contamination of its contents. The apparatus includes a work table on which the package to be opened is placed, a clamping assembly for removably securing the package to the work table, and a cutter blade positioned in an operative relationship with the clamped package. Also included are adjustment controls to allow for adjustment for the width, length and depth of the cut, and control circuitry for effecting movement of the work table in a cutting stroke with respect to the cutter blade, to cut along an edge of the cover, and for automatically reversing the table movement to return it to its starting position. A vacuum system is employed to remove and contain metal fragments and thereby minimize contamination of the package.
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