Diamond compact for a wire drawing die and a process for the production of the same

摘要

This invention relates to a diamond compact for a wire drawing die, which comprises 70 to 95% by volume of diamond powder with a particle size of at most 50 microns and the balance of a binder phase consisting of a carbide of WC or (Mo, W)C with a particle size of at most 1 micron and an iron group metal, the carbide and iron group metal in the binder phase being in such a proportion by weight that the content of the carbide is more than that corresponding to the eutectic composition.