VERFAHREN ZUM BEWERTEN DER MASSGENAUIGKEIT EINES AUF EINEM SUBSTRAT AUSGEBILDETEN MUSTERS UND PHOTOMASKE HIERFUER

摘要

A method for evaluating the measure precision of patterns such as photoresist and etched ones, and a photomask therefor. The photomask according to the present invention has a mask pattern corresponding to a pattern desired to be formed in a substrate, and also has a measure precision evaluating pattern formed at an area different from where the mask pattern is present. The measure precision evaluating pattern comprises a first measure precision evaluating pattern which has a plurality of pairs of pattern elements opposite to each other with a predetermined distance interposed therebetween, and a second measure precision evaluating pattern which has a plurality of pairs of pattern elements overlapped each other in a predetermined measure and arranged opposite to each other to form a constricted portion. The distance or the measure of overlapped area between paired pattern elements is varied with every pair of pattern elements. This mask pattern is transcribed onto the substrate and a pair of pattern elements contacting each other without overlapping is found from the transcribed pattern. Dimensional change is found from the distance or the measure of overlapped area between the pair of photomask pattern elements corresponding to that pair of pattern elements which has been found from the transcribed pattern.