| 摘要 |
PURPOSE:To effect heat dissipation with good efficiency by a method wherein a semiconductor element is installed on a heat sink having a plurality of grooves on a heat dissipating plane and these are sealed by resin. CONSTITUTION:A semiconductor element 1 is fixed to a heat sink 2 and the said semiconductor element 1 is connected to an external lead 3 by a wire 4 and several grooves 2b with U-shaped section are longitudinally and laterally formed on the heat dissipating plane 2a of the heat sink 2 and these are covered with sealing resin 5. In this way, the resin 5 flows into the grooves 2b and some of the resin overflow from the grooves and a thin overflowed resin film 5a is formed on the whole surface of the heat dissipating plane 2a. Heat dissipation will not be decreased as the thickness of overflowed resin 5a can be controlled by sealing conditions. |
