| 摘要 |
<p>PURPOSE:To improve the reliability of a hybrid integrated circuit by forming a plurality of circuit elements of the integrated circuit in an integrated state and then cutting it into a plurality, thereby reducing the irregularity of the circuit elements. CONSTITUTION:An electrode 12 is formed in a predetermined pattern on an insulative substrate 10, a resistor 13 is printed and baked to cross the electrode, is divided into a plurality of resistors via trimming grooves 15, and an overcoating glass 15 is then printed and baked, thereby forming a thick film resistor of a hybrid integrated circuit. In this manner, the irregularity in the characteristics of the elements is eliminated, thereby enhancing the reliability.</p> |
