| 摘要 |
PURPOSE:To prevent the leads from shortcircuiting improving the quality level by a method wherein, when the semiconductor element and the internal leading element are connected by means of the bonding wire, the U type insulating projections are provided on the edge of the internal leading elements. CONSTITUTION:The semiconductor element 4 provided on the element base 3 and the multiple internal leads 1 are connected by means of the bonding wire 2 and the U type insulating projections 5 are provided on the edge of the internal leads 1. Through these procedures, no shortcircuiting happens even if the current generated after sealing by resin comes into contact with the adjoining leads 2. |
