| 摘要 |
PROBLEM TO BE SOLVED: To effectively use a space by independently operating two polishing units free to adjust their height along a rectilinear guide so that only one polishing plate is allotted to each of the polishing units in polishing operation. SOLUTION: A polishing unit 44 moves to a loading and storage device 48 or 50 on which wafers are loaded by a moving device 24 and carries the wafers to a first polishing plate 34 of guides 40, 42. The wafers are lowered on this polishing plate 34 and are treated. After treatment, the polishing unit 44 lifts the wafers on the polishing plate 34, the polishing unit 44 moves the wafers to a second polishing plate 36 from a carried washing station 54, a further polishing procedure is carried out, and after this polishing procedure is finished, the polishing unit 44 moves the wafers to a polishing plate 58. Furthermore, again, the polishing unit 44 stacks these wafers on a transfer device 24 by moving them to the stacking and storage device 48. Additionally, a procedure of a polishing unit 46 is the same as above, and cycle times of these two polishing units have time lags between themselves. |
