发明名称 WAFERBOARD PROCESS
摘要 <p>A process for the preparation of a wood chip board wherein a particulate wood chip furnish is coated with a binding agent, dried and thereafter formed into a board which process comprises the steps of: (a) providing a wood chip furnish derived from either green wood, or wood taken from a log pond; (b) coating the particles of the wood chip furnish over a substantial portion of their surface area with a binder by dip coating the wood chip furnish with a solution, suspension or dispersion of a binding agent in a solvent, whereby less than 15% by weight of binder, based on the dry weight of the wood chip furnish, is coated onto the furnish; (c) adjusting the water and other volatile solvent content of the coated particulate furnish to not more than 15% by weight; and (e) forming the thus treated furnish into a wood chip board under the influence of heat and pressure. This process is capable of providing a wood chip board having the same strength, etc., properties as a plywood, and is thus useful in construction application.</p>
申请公布号 CA1135610(A) 申请公布日期 1982.11.16
申请号 CA19780307775 申请日期 1978.07.20
申请人 REICHHOLD LIMITED 发明人 SUDAN, KRISHAN K.;BERCHEM, ANTOINE
分类号 B27N3/02;B27N3/00;(IPC1-7):32B21/02;29J5/02;B29J5/02 主分类号 B27N3/02
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