发明名称 ULTRASONIC WIRE BONDING METHOD
摘要 PURPOSE:To prevent the disconnection of a wire by bonding the wire so that the length of the wire bonded is extended outside the range of resonance of ultrasonic vibration. CONSTITUTION:A sample is supplied to a feeding section 2 from a loader section 1, forwarded to a sample base plate 3 and positioned. The displacement of the sample is detected by means of a camera at the upper section of a bonding head section 4, and the position of bodning is corrected. An XY driving section 5 and the sample base plate 3 are driven by these data, and a tool 7 held by a horn 6 is moved to the first bonding section. The bonding head section 4 is driven, the tool 7 is dropped, and the first bonding is conducted. The second and succeeding bonding are conducted similarly, but when it is decided that the quantity of the XY driving section 5 moved, the length of the wire, is within the range of resonance of ultrasonic vibration at that time the tool 7 is further guided only by quantity previously set, the length of the wire is lengthened, and the wire is bonded.
申请公布号 JPS57167646(A) 申请公布日期 1982.10.15
申请号 JP19810052801 申请日期 1981.04.08
申请人 SHINKAWA SEISAKUSHO:KK 发明人 YAMAZAKI NOBUHITO;HASEGAWA TAKESHI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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