SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASED POST HEIGHT

摘要

An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.

主权项

1. A method for making a microelectronic substrate, comprising the steps of:
forming a dielectric layer on an in-process unit including a wiring layer having a plurality of conductive elements extending in first and second lateral directions and a plurality of conductive projections extending away from the elements above the wiring layer, the conductive projections having end portions remote from the conductive elements and neck portions supporting the end portions between the conductive elements and the end portions, the end portions having lower surfaces extending outwardly from the neck portion in at least one of the lateral directions, the dielectric layer formed on the neck portions and at least up to the lower surfaces; and removing portions of the dielectric layer to form recessed portions between the projections.