发明名称 TESTING DEVICE FOR HEAT RESISTANCE AGAINST SOLDERING HEAT OF COPPER PLATED LAMINATED PLATE FOR PRINTING CIRCUIT
摘要 PURPOSE:To eliminate personal error in making the test in the title by catching sound made by explosion of a test piece due to the heat from solder and changing the sound into electric current with a controller and displaying the time of explosion on a display device and also recording it with a printer. CONSTITUTION:A test piece is set at the test piece box 1 of a testing device, and it is pushed out by a test piece supplier 2, and seized by a test piece grabbing device. A test piece charger 4 rotates to place the test piece on a solder bath. When the test piece explodes by the heat of the solder, a sound collector 7 catches the sound of explosion, and the sound is changed into electric current by means of a controller, and the time of explosing is displayed on a display device 8 and recorded by a printer 9. A testing device as described above can eliminate personal error when a person watches the solder bath face and notes delicate change on it in the conventional testing.
申请公布号 JPS57160051(A) 申请公布日期 1982.10.02
申请号 JP19810045803 申请日期 1981.03.27
申请人 HITACHI KASEI KOGYO KK 发明人 TAKAHASHI YOSHIHISA;INAMI MASAO;OOZEKI YOSHIE
分类号 G01N25/50;G01N25/54;(IPC1-7):01N25/54 主分类号 G01N25/50
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