发明名称 HEAT SINK DEVICE
摘要 PURPOSE:To obtain the titled device having high heat dissipating effect by providing many fins mounted at the end side of a heat transfer unit and a side wall formed vertically to a side plate. CONSTITUTION:An insulating plate 7 is secured onto a heat sink 6 with insulating collars 11 and screws 12, a semiconductor element 8 is mounted on the plate 7, and a heat pipe 1 in which porous substance 3 immersed with water, Freon or alcohol therein and made of metal gauze or glass wool is engaged through the heat sink 6. Then, fins 5 held by a plurality of side plates 4 are engaged via central holes opened at the plates 4 with the peripheral surface of the pipe 1 at the part projected from the heat sink 6, and one lower ends of the plates 4 are secured via screws 9, 9' to a housing wall 10. Thereafter, side walls 13 are bonded to both ends of the side plates, a heat sink device is formed in a chimney shape with the plates 4 and the walls 13, and air guide holes 14 are opened at the side walls 13 to enhance the chimney effect.
申请公布号 JPS57157551(A) 申请公布日期 1982.09.29
申请号 JP19810042434 申请日期 1981.03.25
申请人 HITACHI SEISAKUSHO KK;HITACHI DENSEN KK 发明人 RIYOUDORI MICHIO;TATSUMI ARITAKA
分类号 H05K7/20;F28D15/02;H01L23/427 主分类号 H05K7/20
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