摘要 |
A process for producing chipboards, fibreboards or similar boards is described in which, for the purposes of an improved density distribution across the entire cross-section and to minimise the edge losses, before a substantial compression is carried out, the non-woven fabric is introduced without an air gap between the heating electrodes and the actual compression operation is only carried out when the non-woven fabric has been heated to a temperature of at least 40 DEG C by means of the high-frequency energy.
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