| 摘要 |
PURPOSE:To prevent the refrigeration of a semiconductor element due to direct contact with the low temperature liquid of the element by forming a sealed container hermetically sealing the element with a thermally conductive member and refrigerating the element via the member with the low temperature liquid. CONSTITUTION:A semiconductor element 1 is contained in a sealed container 7 formed of a heat transfer plate 5 of copper having good thermal conductivity and a partition wall 6. The element 1 is mounted via a substrate 8 made of insulator on the plate 5. Holes 10 partitioned with the plates 5 and conducting the space 9 containing the element 1 are formed at the plate 5. On the other hand, the interior of the container 7 and the exterior of the container 7 are communicated via a conduit 12 through a valve 11. Dry gas of the same type as the low temperature liquid used for the refrigeration is sealed in the space 9 in the container 7. The container 7 is dipped in the liquid 2 in the container 3 coupled via conduits 13, 14 with a cooler. |
