| 摘要 |
PURPOSE:To reinforce the desired part of a substrate metal by disposing specific metallic powder, foil, plate or wire on the desired part of the metal, then heating and melting the specific metal by concentrating heat wire and alloying the metal by diffusion. CONSTITUTION:An oxygen free copper strip having, for example, 35mm. wide, 0.4mm. thick and 50% of working degree is prepared as the material of a lead frame, is punched by an automatic press, and is machined to a lead frame 1 for an integrated circuit. After an IC is assembled with the lead frame 1, an Sn paste is coated to a lead leg reinforced part 4 coated with black color of the lead. Then, the reinforced part 4 is heated by a laser to diffuse the Sn therein so as to alloy the reinforced part 4, thereby partly reinforcing the material. At this time, an organic solvent in the paste is evaporated, and only the Sn is retained on the surface. |
