Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation

摘要

The power device is mounted in a box the base plate (12) of which is made of a good thermal conductive metal. The plate is provided with parallel fins (14) perpendicular to the plate. A liquid such as water is forced to circulate between them contained in a cavity between the base plate and a lid (15). The fluid is pumped in and out through two openings (16,17) in the lid and a deflector (17) between the openings ensures an even circulation. The fins are spaced by half their thickness and are either directly machined or brased to the base plate. The seal (19) between the plate and lid is shaped to ensure an even flow and the rate of flow is maintained by the input pressure. The lateral dimensions of the cooling zone of the component are less than the lateral dimensions of the encapsulating package of the electronic component.