发明名称
摘要 PURPOSE:To perform excellent soldering in a short time, by providing a solder receiver under copper wire so as to allow the flowing solder to contact with the whole periphery of the copper wire. CONSTITUTION:Solder 2'' contained in a vessel 1'' is melted by heating with a heater 4'', and is poured from above down to copper wire 3'' through a duct 7'' by the rotation of a motor 5'' and a propeller 6''. The flow direction of the solder is changed by a solder receiver 11'' installed at the under part 8'' of the copper wire 3'', and sufficient amount of the solder flows through the under part 8'' of the copper wire 3'', thereby forming no part low in flow density. Therefore the best use of excellent heating property of the solder 2'' to the copper wire 3'' is made, preventing uneven finish of soldering, consequently soldering is performed excellently in a short time.
申请公布号 JPS5737423(B2) 申请公布日期 1982.08.10
申请号 JP19790105297 申请日期 1979.08.17
申请人 发明人
分类号 H05K3/34;B05D1/30;B05D7/20;B23K1/08;B23K3/06;C23C2/00;H01R43/02 主分类号 H05K3/34
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