| 摘要 |
PURPOSE:To reduce cost of a semiconductor device by a method wherein an evaluation on a wafer is performed without any wasted wafers by utilization of a non-destructive test method. CONSTITUTION:Several numbers of wafer are picked up among a lot of wafers on which semiconductor elements and oxide films are formed. Subsequently except several blocks 8 among a number of circuit element blocks which is arranged in column and row on a wafer 1, the surface of the wafer 1 is covered with a photo resist 7. Next by using an etching solution for detecting crystal defects the surface of the wafer 1 is etched. Next the surface of the wafer in the testing region 8 is inspected by a microscope, and existence of etched pits due to crystal defects in silicon and their distributions are inspected, and evaluation and judgment whether the wafer is good or bad is performed. If the wafer is defective, it is discarded and if it is acceptable, the photo resist film on the wafer is removed and restoration to the former wafer group is performed. By this method the circuit block covered with the photo resist 7 can be used without any break therein. |
