摘要 |
1. Cooling body block with two cooling bodies (2, 2'), which are held together with one or more semiconductor disc cells clamped between them under contact pressure at planar contact surfaces, with a respective moulded part (1, 1') of an insulating synthetic material placed against the front and rear end faces of the two cooling bodies, characterised thereby, that these moulded parts are frames (1, 1') with straight middle limbs (11, 11'), which close off the free space between the mutually facing cooling ribs of the cooling bodies (2, 2'), and with outer limbs (12, 13, 12', 13'), which respectively close off half the free space between the cooling ribs of the cooling bodies of adjacently arranged cooling body blocks, and that the two moulded parts are each latchable at oppositely disposed end faces of the cooling block by means of two C-shaped rails (21, 21', 22, 22'), which serve as electrical connecting tracks of the cooling bodies, project out from the moulded parts and are framed by a respective one of two passages (14, 14', 15, 15'), which are both separated each from the other by the middle limb (11, 11'), and of which a respective one is shaped on at each end face (St1 , St2 ) of each cooling body. |