| 摘要 |
A Minimum Delay Module Assembly, having unrestricted accessibility for servicing, that provides substantially constant electrical and thermal environments for all portions of the assembly regardless of configuration. The assembly comprises a plurality of vertical page modules in which each page module is vertically hinged to the adjacent page module. Electrical interconnections are provided between the page modules by means of cable assemblies which enter each page module in the edge thereof adjacent said hinges. Individual self contained cooling means are provided for each page module so that the flow of air is up through the bottom of each page module and out through the top thereof. Resilient conduit means may be utilized to supply a pressurized coolant to each page module regardless of the configuration of the module assembly. The complete vertically hinged module assembly is supported on a base assembly, including a foraminous base member sufficiently large to support said hinged module assembly when in the closed position and further including at least one foraminous foldable shelf which folds out of the way when the assembly is in the closed position and folds to a position coplanar with said base member when in the "open for service" position. The base assembly further includes a chamber or space under the base member which provides for an unrestricted flow of air up through said base member. |
