| 摘要 |
PURPOSE:To improve a heat dissipating effect without causing the enlargement of the device and the sharp rise of cost by ameliorating sealing with resin. CONSTITUTION:A semiconductor 3 is bonded and fixed to a metallic lead 1 by using solder 2, and an electrode on the element 3 and an external pull-out electrode 4 are wire-bonded by bonding wires 5, and sealed with epoxy resin 6. The size of the sealing is within an extent that the lead 1, the electrode 4, the element 3, etc. do not extrude to the outside, and is small-sized as much as possible. Sealing resin is prepared which is obtained by mixing resin and a material of which a metal having high heat conduction such as copper is changed into powder in several micron, and the outside is sealed with the metal mixed resin 11 so as to form the same shape as conventional methods. Accordingly, the dissipating effect of heat is improved, and the characteristics of the device are stabilized. |
