| 摘要 |
PURPOSE:To form a small-sized and highly reliable light module by a method wherein the conversion element of the light module and the peripheral circuits are composed integrally by a light coupling section and a mold. CONSTITUTION:A transparent molding substance 57 is formed to coat a conversion element 60, IC chip 55, and bonding wires 56 by using a lead frame group 54 as reference. The second-stage light impermeable molding is performed in united structure with a light connector coupling section by agreeing the central core section 64 in a light connector plug 63 with the luminous center of the conversion element. Consequently, a highly reliable and small-sized light module can be obtained at low cost. |
