| 摘要 |
PURPOSE:To prevent generation of mutual contact between bonding wires of an integrated circuit device by a method wherein straight lines connecting respectively the bonding part of an electrode and a bonding pad of semiconductor chip are made so as not to be piled up. CONSTITUTION:The bonding pads 22 and the electrodes 23, 24 are arranged as the straight lines connecting the bonding parts on the bonding pads 22 of the chip 20 and the bonding parts 26 on the electrodes 23, 24 of a package are made as to be converged to the center O of the chip 20. Accordingly, because the bonding wires 21 are extended toward the outside circumference of the integrated circuit device, short-circuit to be generated by mutual contact is not generated. |
