| 摘要 |
PURPOSE:To accurately and readily measure the orthogonality of chip patterns by intimately contacting a reference substrate directly with a substrate to be measured and made of master mask substrates to be treated or the like, thereby equalizing the temperatures of both the substrates. CONSTITUTION:A sub scale 3 having a segment patterns at an accurate pitch interval PB and uniform width WB along the dicing lines 2 of four directions surrounding the square chip region 1 is formed thereon, and a mark 4 is provided at the center of the sub scale 3. Then, a plurality of chip patterns 5 thus formed are used, are arranged in lattice state, are transferred to form a large master mask to be treated, and the same scale as the sub scale 3 of the chip pattern is formed in four directions. Thereafter, a master scale 9 having an accurate pitch interval PA and uniform line width WA and a mark 10 are provided at the periphery in the same size as the master mask are provided on a glass substrate 8 of reference substrate 7, and are superposed directly on the substrate 7, and the orthogonality can be obtained in the pattern from the scales 3, 9 and the mark 4, 10. |
