发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To raise reliability by a method wherein wire bonding with a capillary, pull-cut of the wire and a ball forming at wire cutting end are processed in a state where the slack of the wire between a bonding position and a pull outclamp has been removed. CONSTITUTION:A capillary 6 and the like descend to a point 22 so as to form a loop 23, and a tip of the capillary 6 presses down a midpoint of a wire 1 to a point 22 softly. A solenoid 19 is then energized, and a wire reel-out preventing clamp 13 is raised and rocked by weaker force then cutting strength of the wire 1. And, the capillary 6 pressed and bonds the wire 1 to the point 22. After that, the capillary 6, a pull cut clamp 5, and an arm 16 rise to cause a prescribed tail quantity to be drawn out, and at the time when the rise terminates the pull cut clamp 5 is closed. And, the closed pull cut clamp 5 rises together with the capillary 6, thus the wire 1 is cut at an upper part of the bonded part.
申请公布号 JPS5766648(A) 申请公布日期 1982.04.22
申请号 JP19800143125 申请日期 1980.10.14
申请人 FUJITSU KK 发明人 IMAI SATORU;NIIKURA HIROSHI;SAKAHARA HIROSHIGE;HIRATA KANEKI
分类号 H05K3/32;H01L21/60 主分类号 H05K3/32
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