| 摘要 |
PURPOSE:To obtain an element superior in resistance to cooling and heating shock, and heat resistance, by forming a photosensitive resin composition layer consisting of a urethane di(meth)acrylate compound, a polymer, and a sensitizer on a support film. CONSTITUTION:A photosensitive resin composition is obtained by mixing (A) 20- 75pts.wt. urethane di(meth)acrylate compound obtained by reacting trimethylhexamethylenediisothianate with divalent alcohol mono(meth)acrylate; (B) 20-75pts.wt. linear polymer having 40-150 deg.C glass transition point, such as methylmethacrylate- methacrylic acid copolymer; and (C) 0.5-10pts.wt. sensitizer, such as 2-ethyl-anthraquinone. This composition is dissolved into an organic solvent, this solution 10 is coated on a support film 16 fed from a roller 5, dried with a 80-100 deg.C dryer 11 to form a composition layer, a cover film 17 fed from a roller 12 is applied to the composition layer, and wound around a roller 15.
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