| 摘要 |
<p>PURPOSE:To complete the division of the semiconductor wafer in a single dividing process and to prevent such troubles as scratching and pressing of aluminum by improving the shape of a break block. CONSTITUTION:The head part of the break block 6 is shaped into a part of a spherical surface. On the semi-spherical break block 6 thus prepared a vinyl chloride sheet (an expane sheet) 4 is set and a scribed semiconductor wafer 1 is placed thereon. Next, by a driving mechanism, a thin rubber plate 8 retaining in a frame 7 is lowered in such a manner that it covers the wafer. As a result, the semiconductor wafer 1 is pressed by the rubber plate 8 along the semi-shperical break block 6 and is split along scribe lines. At this time, the wafer 1 is split in two directions of the scribed lines perpendicular to each other and the wafer 1 thus split turns to be a separate semiconductor element chip, which sticks to the vinyl chloride sheet 4.</p> |
