| 摘要 |
PURPOSE:To facilitate exterior formation and assembly, and reduce manufacturing cost, by cutting off and terminating lead frames, after holding and mounting an IC board with a lead of lead frames, and coating the whole surface thereof with exterior resin by means of fluid dipping. CONSTITUTION:In a manufacturing process of a resin-sealed DIP bybrid IC, clamps 4 are attached to the junctions of leads 3, 3' of lead frames. Terminals of a board 2 are engaged to make a rough assembly 10. Next, the assembly 10 is coated on the whole surface including the lead frames with exterior resin 6 made of epoxy resin flour by means of fluid dipping. Next, a frame 5 is cut off at line 8 position. The lead 3 is bent perpendicularly at line 7 position. The resin applied on the lead 3 is removed to complete the assembly. This arranges the board and the lead frames level, facilitates exterior formation, and reduces the cost of equipment and exterior. |
