发明名称 |
Non-flammable adhesive compositions |
摘要 |
The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.
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申请公布号 |
US4323659(A) |
申请公布日期 |
1982.04.06 |
申请号 |
US19800212801 |
申请日期 |
1980.12.04 |
申请人 |
SONY CORPORATION |
发明人 |
WATANABE, MASANAO;NAITO, KEIICHI;ODAJIMA, TOORU;FUJIWARA, YOSHIO |
分类号 |
C08G59/00;C08G59/20;C08G59/30;C08G59/40;C08G59/62;C08L33/00;C08L33/02;C08L63/00;C09J133/04;C09J163/00;C09J163/02;C09J163/04;H01B3/40;H05K1/00;H05K3/38;(IPC1-7):C08L63/00 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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