| 摘要 |
PURPOSE:To miniaturize a hybrid parts in a stabilized DC source or the like by a method wherein a ceramic smoothing capacitor serves as a substrate on which an IC or some components thereof are packaged. CONSTITUTION:A patterned conductor 13 and a resistor 14 are installed on the upper surface of a capacitor 10 that is a ceramic element 11 provided with electrodes 12 on its both sides, the aggregation constituting a thick film substrate. Mounting the thick film substrate are an active element 15 and a passive element 16 that are connected to the conductor 13 with a lead 17 and covered by a protective film 18. Another device can be connected to this hybrid device by a face-down bonding to the conductor 13 located on the electrode 12 when a joint use of the electrode 12 is feasible. The ceramic capacitor upper surface restivity being in the vicinity of 10<15>OMEGA/cm, a thick film circuit can be constituted without any difficulties. This eliminates wiring caused stray capacity and miniaturizes the device. |
