TEMPERATURE SENSOR ELEMENT

摘要

PURPOSE:To reduce substance interposed between semiconductor material and a metal pipe and raise the thermal response property, by a method wherein a cup- shaped forming body of heat-resistant insulation material is inserted in the metal pipe and the cup-shaped forming body is filled with the semiconductor material. CONSTITUTION:A cup-shaped forming body 10 made of heat-resistant insulation material such as alumina, mullite or forsterite is inserted in a metal pipe 9. Then a metal terminal 11 is inserted in the cup 9. Semiconductor material with large resisrance-temperature coefficient is filled in the cup-forming body 10 and tip of the metal terminal is inserted. In turn, heat resistant insulation material 12 of powder of magnesia or alumina is filled in residual space of the metal pipe 9. Thereby the diameter of the metal pipe is reduced and the semiconductor material 15 is heated and sintered so as to perform sealing 13.