| 摘要 |
<p>PURPOSE:To prevent the warping of a heat sink and to perform resin sealing having superior dampproofness, by a method wherein a heat sink is provided with a linear groove along the longitudinal direction of the side adhering a semiconductor element and at least a semicircular curved groove to enclose the semiconductor element in a right angular direction. CONSTITUTION:A linear groove 12 is formed along the longitudinal direction of a heat sink 11. This is effective to prevent the warp of the heat sink 11 caused by resin material contracting action after sealing the heat sink with a resin material. An oval groove 13 is formed contacting with the linear groove 12 and crossing the linear groove 12 at right angles. This method is effective for dampproofness as a semiconductor element 3 is enclosed by the oval groove 13. This method prevents the warping of the heat sink and improves dampproofness and forms a resin sealed- type semiconductor device of high quality and high reliability.</p> |
