| 摘要 |
PURPOSE:To reduce mounting areas by disposing semiconductor stacks divides so as to be stacked up and down in the boiling cooling type semiconductor device. CONSTITUTION:The second semiconductor stack 3B is arranged to a lower section of the first semiconductor stack 3A, and a condenser 2 is mounted to an upper section of the first semiconductor stack 3A. The first heat transport pipe 5A communicating an evaporator 4 and the condenser 2 of the first semiconductor stack 3A and the second heat transfer pipe 5B communicating the evaporator 4 of the first semiconductor stack 3A and an evaporator 4 of the second semiconductor stack 3B are disposed. The first and second heat transfer pipes 5A, 5B are composed of insulating pipes 7 and a bellows 6. The terminals 14 of the evaporators 4 and electrical members 8A, 8B are connected by conductors 9. |
