| 摘要 |
PURPOSE:To prevent the damage of a chip by a method wherein the chip is placed on a chip mounting surface of a package base body, and the chip is held again by means of tweezers and oscillated so as to be sufficiently parallel with the chip mounting surface when fitting a die. CONSTITUTION:The chip 1 is held by means of tweezers 2, and carried and placed onto the package substrate 3, and the tweezers 2 are separated from the chip 1. The noses of the tweezers 2 are contacted with the substrate 3. The noses of the tweezers are elevated only by a predetermined distance d, and the chip is held a gain, and oscillated left and right so that the chip and the chip mounting surface of the substrate run parallel sufficiently. Accordingly, the die can be fitted without damaging the chip. |
