| 摘要 |
PURPOSE:To increase the effective area of a circuit substrate and to mount an IC in high density by forming in advance a sealing pellet smaller than the device hole for mounting the IC using a flexible film for the substrate, placing it on the IC and sealing it with resin. CONSTITUTION:A hole for device hole 8 for mounting an IC is opened at a flexible film 1, the finger 2b of a circuit substrate 10 and the bump 3a of the electrode of an IC3 are simultaneously thermally pressed and bonded on a copper foil pattern 2a, and a sealing pellet 17 smaller than the device hole formed in advance is placed on the finger 2b. At this time the connecting part 17a of the outer periphery of the pellet 17 and the outer periphery of the IC3 are engaged, the sealing pellet is positioned, and is molded and cured by heat treatment. In this manner, the sealing area can be reduced, and the mounting density can be increased. |
