| 摘要 |
PURPOSE:To electromagnetically shield an element, enable to miniaturize a circuit, increase the productivity and cut down the cost for the subject electronic parts by a method wherein, after a hybrid IC and the like have been sealed by resin, an element is electromagnetically shielded by tightly adhering and forming a metal shielding layer, having a prescribed thickness, on the outer surface of the resin layer. CONSTITUTION:For example, sensitivity-increasing and activating processes are performed by coating a Pd film on almost the whole surface of the hybrid IC1 whereon a resin layer 3 was formed, for example, using a powder fluidized bed coating method. Then, after a copper layer of 0.2-0.3mum in thickness has been formed by performing nonelectrolytic plating, a shielding layer 4, consisting of a copper layer of 10-200mum in thickness formed by performing electro-plating, is formed. Also, as occasion demands, the shielding layer 4 is protected by coating an insulating layer on it. As the resin layer 3 and the shielding layer 4 are formed along the concavo-convex part of the elements 11 and 12 on the circuit 1, a high density and small-sized circuit 1 can be manufactured. Also, as a result of the above, the mas- production and automation of the parts can be accomplished, thereby enabling to cut down the cost of the products. |
